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Procurement & Sourcing

Advanced Packaging Substrate Supplier Enablement Lead

Intel

Location
Phoenix, AZ, United States · On-site
Type
Full-time
Level
Lead / Manager
Posted
Today

Overview

Job Details Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer…

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Advanced Packaging Substrate Supplier Enablement Lead at Intel | AllSCMJobs